Leaked specifications for Google’s Tensor G5 indicate a significant departure from the previous versions. Google would likely use five Cortex A7-25 CPU cores and two Cortex A520 CPU cores to balance performance and power efficiency.
Recently, Google launched the Tensor G4 chipset by collaborating with different companies and plans to launch the next generation of chipsets, including Tensor G5 and Tensor G6 which would be completely designed by Google.
According to reports from Android University, much information regarding the specification of the Tensor G5 has been leaked from Google’s Tensor chip division. Google’s Tensor G5 chips would probably use a 1+5+2 CPU cluster, ie the chipset would comprise of single core for prime performance, five cores for performance, and two cores for efficiency indicating a basic approach while designing chips. The previous version, Tensor G4 used a 1+3+4 CPU cluster with a single prime performance core, three performance cores, and four efficiency cores.
The long-term plan of Google to shift from Samsung TSMC to manufacture Tensor chips would be attained by 2025, according to rumours Tensor G5 chips would be manufactured by industry-leading TSMC using their 3nm process. According to industry insiders, Google’s next SoC will have more similarities with Apple’s chipset.
Tensor G5 chips have moved to Cortex A725 from Cortex A720, however, Cortex A520 remains unchanged. Google has been depending on Arm Mali GPUs for the previous Tensor chipsets, a GPU powering a large number of smartphones offering multiple-tier performance. Google is trying a new GPU from Imaginary Technologies (IMG) for Tensor G5 chips. It is known to be a powerful GPU with a 1 GHz speed. With an IMG GPU, google aims to implement ray tracing support in the upcoming Pixel 10 smartphone series.
The new Pixel 10 series will provide high-resolution gaming with the support of GPU Virtualisation making accelerated graphics possible. The Tensor Processing Unit (TPU) increases the performance by 14%.
These shifts in components indicate a potential for enhancement in Artificial Intelligence capabilities, improved graphics, balanced performance, and efficiency along with more control over development and optimization of chips.
In addition to the Tensor G5 chips, Notebookcheck has published the leaked features of Tensor G6 chips too. The ‘Malibu’ codenamed Tensor G6 chip’s CPU cluster moves from 1+5+2 to 1+6 core configuration. It uses two unreleased Arm Cortex-X930 and Cortex-A730. Powered with Snapdragon X Elite chips, it could compensate for the lack of efficiency cores.
What can we expect in Google Pixel 10 with Tensor G5?
Unconventional CPU core configuration
A single high-performance Cortex-X4 core, five Cortex-A725 cores, and two power-efficient Cortex-A520 cores.
Whole new GPU
Looking for a change from the Arm Mali G75 used in the previous chip versions, Google is likely to use dual-core IMG DXT GPU supporting ray tracing and virtualization.
Enhanced TPU
The modified Tensor Processing unit used is expected to deliver a 15% increase in AI performance.
Changed manufacturer
Tensor G5 is to be manufactured by industry-leading TSMC and plans a cut-off from Samsung which manufactured all the previous Tensor chips.
Manufacturing process
The chip will be manufactured using a 3nm process powered by TSMC. It is likely to use TSMC’s N3E node which is also used in Apple A17 pro chips.
Increased Die size
The larger Die size 121 millimetres square, is higher compared to Apple 18 pro chup which is only 105 millimetres square.
It will be interesting to know how the expected changes would turn out, once integrated with pixel 10 devices. Remember, this information is based on leaks and no official announcement has come from Google yet.
